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Sauna V4.31 Features

Sauna Overview

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Duty Cycle Transient

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Modeling System

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Thermal Software Home

Enclosure model created with Sauna

Welcome to the official website of the Sauna™ thermal modeling software package. The Sauna software package can be used to simulate a wide variety of electronic components and systems, such as heat sinks (heatsinks), circuit boards (PCB's), semiconductor stackups (BGA, QFP), high-power LED's, complete boxes and complex duty cycle transient problems.

perform trace-by-trace board modeling


The Sauna program is quite easy to use. Complex 3D models are created by combining the "building blocks" of circuit boards, plates, and plates with fins. Heat transfer coefficients for both convection and radiation are calculated automatically. All these powerful features are provided at a very moderate price. Sauna can be run on virtually any contemporary Windows PC.


To learn more about Sauna, please use the index bar on the left to view the many informative pages contained on this site. It is suggested that you start with Sauna Overview. (If you're in a hurry, just look at the pictures.) A free evaluation package is also available. Feel free to ask questions, contact information is available here.
 

Latest News:

16 Oct 2014: Sauna V4.31 is available. As described in the Sauna V4.31 Features List, Sauna V4.31 provides numerous enhancements: enhanced heat sources with a library of 150+ components (QFP, heat slug devices, flip chips, LED packages), an internal board subdivide command for rapid creation of board stackups, multi-junction footprint heat sources, and much more!

12 Oct 2013: Sauna training session on Wednesday, November 19, 2014. This is an excellent opportunity to learn more about the many new features contained in Sauna V4.3. For more information, click here.

 
HOME | Sauna Overview | Free Evaluation Package | Quick And Dirty Thermal ? | Control Elements | Duty Cycle Transient
Pricing | Sauna Standard vs. Sauna Modeling System | Feature List | Frequently Asked Questions (FAQ) | Hardware Req.
User Quotes | Training Sessions | Papers/Articles | Thermal Modeling Consultants | Contact Us
 
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Phone: 734-761-1956  Fax: 734-761-9855   Email: GenInfo@thermalsoftware.com